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Solder Preforms and Solder Ribbon



JAYTEE SOLDER PREFORMS provide a Good quality of solder for each solder joint that is uniform over high volumes. This provides high volume solder assembly operations with increased yield via precise delivery & control of solder to each interconnect.

Available Alloys :

JAYTEE is manufacturing the solder preforms in a wide range of Low Melting Point alloys ranging from 47⁰C to 356°C. These alloys include gold-tin/gold-germanium, pure indium and indium-Tin, Indium-Lead alloys, RoHS compliant Lead-free alloys, and standard tin-lead compositions.

Dimensions / Shapes:

JAYTEE is manufacturing solder preforms in any size or shape including rectangles, washers, discs, and frames and customized; length/width/diameter: 0.010" and greater, thickness: 0.001" and greater.

Fluxes :

JAYTEE is manufacturing solder fluxes and cleaners for use with solder preforms. Available flux are RA, RMA, No Clean and Water Soluble. Fluxes can be in liquid or paste forms. solder preform can be supplied with flux coating.

Common Recommended Preform & Foil Tolerances

We can manufacture any part to customer specified dimension/tolerance

Tolerances
  • +/- 0.002 inches
  • +/- 0.0025 inches
  • +/- 0.005 inches

  • +/- 0.0002 inches
  • +/- 0.0005 inches
  • +/- 0.001 inches
  • +/- 0.002 inches

JAYTEE Solder preforms has wide range of compositions with physical properties suited to specific application requirements. Below is listed a selection of the most commonly used Solder alloys for specific applications. In addition to these alloys, JAYTEE have the various Alloys with melt points ranging from -19°C up to 356°C.

THERMAL INTERFACE / HIGH DUCTILITY MATERIAL

ALLOY COMPOSITION SOLIDUS LIQUIDUS DENSITY DENSITY
WEIGHT % °C °F °C °F g/cm3 lb/in3
51.51n 32Bi 16.5Sn 60 140 60 140 8.2 0.2958
521n 48Sn 118 244 118 244 7.3 0.2635
971n 3Ag 146 295 146 295 7.38 0.2664
1001n 156.6 313 156.6 313 7.31 0.2639
1001n+* 156.6 313 156.6 313 7.31 0.2639

MEDICAL GRADE / LEAD FREE SOLDER

ALLOY COMPOSITION SOLIDUS LIQUIDUS DENSITY DENSITY
WEIGHT % °C °F °C °F g/cm3 lb/in3
SAC305 217 423 218 424 7.38 0.2659
96.5Sn 3.5Ag 221 430 221 430 7.36 0.2657
96Sn 4Ag 221 430 238 460 7.31 0.264
CASTIN 211 412 226 439 7.36 0.2664
80Au 20Sn 280 536 280 536 1451 0.5242

LOW TEMPERATURE SOLDER

ALLOY COMPOSITION SOLIDUS LIQUIDUS DENSITY DENSITY
WEIGHT % °C °F °C °F g/cm3 lb/in3
51.51n 32Bi 16.5Sn 60 140.0 60 140 8.2 0.2958
521n 48Sn 118 244 118 244 7.3 0.2635
58Bi 42Sn 138 281 138 281 8.56 0.309
43Pb 43Sn 14Bi 144 291 163 225 8.99 0.3245
1001n 156.6 313 157.6 313 7.31 0.2639

DIE ATTACH / DIE PACKING SOLDERS

ALLOY COMPOSITION SOLIDUS LIQUIDUS DENSITY DENSITY
WEIGHT % °C °F °C °F g/cm3 lb/in3
1001n 156.6 313 156.6 313 7.31 0.2639
80Au 20Sn 280 536 280 536 14.51 0.5242
92.5Pb 5Sn 2.5Ag 287 549 296 565 11.02 0.3978
97.5Pb 1.5Ag 1Sn 309 588 309 588 11.28 0.4072
88Au 12Ge 356 673 356 673 14.70 0.5310

JAYTEE SOLDER PREFORMS APPLICATION



Description

Pure indium ribbon is used specially for sealing, cryogenic applications, and joining many non-metals and metal. Indium ribbon also has an excellent thermal interface properties and allows for CTE mismatch.

  • Alloy: 99.99 Indium
  • Size: 1.00″ x .002″
  • Quantity: 1 ft / 1Mt Spool
  • Liquidus Melting Temperature: 157°C MP
  • Solidus Melting Temperature: 157°C MP

Alloy 99.99In(4N) / 99.999 In(5N) / 99.9999 In(6N)
Width 10 mm to 25 mm
Thickness 50 Micron to 200 Micron
Packaging 1 ft / 1 mt
Unit of Measure Spool

Solder Ribbon and Foil


Introduction

JAYTEE Solder Ribbon and Foil manufacturing is available in many standard alloys (Leaded /Lead Free) and sizes. Material can also be made as per customer requirements.

Solder Ribbon Foil is supplied in continuous lengths and is packaged on spools or maybe in cut pieces or sheet forms.

Ribbon Dimensions

JAYTEE has capabilities to manufacture widths as small as .020" (.5mm) and up to 2.25" (57.15mm). Thicknesses range from .001" (.025mm) up to as thick as your application requires.

We can work with you on your specific dimensional requirements. Our typical tolerances are:

Table1

Width
Up to .099" (2.5mm) ±.010" (.254mm)
.100" to .999" (2.54 to 25.37mm) ±.025" (.635mm)
Over 1.00" (25.4mm) ±.040" (1.01mm)
Thickness
Up to .001" (.025mm) ±.0002" (.005mm)
.001" (.025mm) to .002" (.050mm) ±.0003" (.0076mm)
>.002" (.050mm) to .010" (.254mm) ±.0005" (.0127mm)
>.010" (.254mm) to .020" (.508mm) ±.0010" (.0254mm)
>.020" (.508mm) to .050" (1.27mm) ±.0025" (.0635mm)
>.050" (1.27mm) ±5%

Shelf Life

The shelf life of solder Ribbon / Foil is dependent on the alloy composition. Pb-free alloys, and alloys with lead content of <50%, have a shelf life of 1 year from the date of manufacture (DOM). . lead content>50% have a shelf life of 6 months from the DOM.

Foil Dimensions

For applications requiring material wider than 3", we make solder foil sheets as per customer requirement. We also can custom-cut sheets in larger sizes.

Standard tolerances on foil dimensions will be applicable.

Available Materials

You can choose the solder Alloys grade as per your specific requirement from the Table 2. Which listed on the book of this data sheet.

Storage

Store Solder Ribbon and Foil in the Tightly closed container in standard room temperature. It can also be stored in an inert atmosphere, such as a nitrogen dry box.

Packaging

We have developed standard packaging based on alloys compositions and ribbon widths or as per customer specific requirements.

Each order can be shipped with a Certificate of Analysis which includes information on metallic impurities. We can also provide a Certificate of Conformance when Solder Ribbon and Foil is made to customer specifications.

Technical Support

JAYTEE also provide technical assistance to our customers. Thoroughly knowledgeable in all facets of Material Science as it applies to the electronics and semiconductor sectors, Technical Support Engineers provide expert advice in solder properties, alloy compatibility and selection of solder preforms, wire, ribbon, foil, and paste.

Safety Data Sheets

JThe SDSs for these products can be provided as per customer requirements.

Some Physical Properties of Common Solder Ribbon and Foil Alloys

Table2

Liquidus (°C/°F) Solidus (°C/°F) Composition Plastic Range (°C/°F) Mass Density (gm/cm3) Electrical Conductivity (% of Cu) Thermal Conductivity W/cm°C @85°C Thermal Coefficient of Expansion µ in/in/°C @ 20°C Tensile Strength (psi) Bond Holding Strength (Shear) (psi)
118/244 118/244 52In/48Sn Eutectic 7.30 11.70 0.34 20.0 1,720 1,630
143/290 143/290 97In/3Ag Eutectic 7.38 23.00 0.73 22.0 800 NA
154/309 149/300 80In/15Pb/5Ag 5/9 7.85 13.00 0.43 28.0 2,550 2,150
157/315 157/315 100In Melting Point 7.31 24.00 0.86 29.0 273 890
167/333 154/309 70Sn/18Pb/12In 13/24 7.79 12.20 0.45 24.0 5,320 4,190
175/347 165/329 70In/30Pb 10/18 8.19 8.80 0.38 28.0 3,450 NA
179/354 179/354 62Sn/36Pb/2Ag Eutectic 8.41 11.90 0.50 27.0 7,000 7,540
181/358 173/343 60In/40Pb 8/15 8.52 7.00 0.29 27.0 4,150 NA
183/361 183/361 63Sn/37Pb Eutectic 8.40 11.50 0.50 25.0 7,500 6,200
210/410 184/363 50In/50Pb 26/47 8.86 6.00 0.22 27.0 4,670 2,680
221/430 221/430 96.5Sn/3.5Ag Eutectic 7.36 16.00 0.33 30.2 5,620 NA
232/450 232/450 100Sn Melting Point 7.28 15.60 0.73 24.0 1,900 NA
260/500 240/464 75Pb/25In 20/36 9.97 4.60 0.18 26.0 5,450 3,520
280/536 280/536 80Au/20Sn Eutectic 14.51 NA 0.57 16.0 40,000 40,000
356/673 356/673 88Au/12Ge Eutectic 14.67 NA 0.44 13.0 26,825 26,825
1,064/1,948 1,064/1,948 100Au Melting Point 19.30 73.4 3.18 14.0 18,000- 20,000 NA

JAYTEE ALLOYS CAN SUPPLY BULK QUANTITIES OF SOLDER PREFORMS AT BEST POSSIBLE RATES. IT CAN ALSO MANUFACTURES VARIOUS KINDS OF SOLDER PREFORMS AND CAN SUPPLY AS PER CUSTOMER REQUIREMENT. KINDLY CONTACT US FOR MORE INFORMATION.
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